BGA Rework Solder Oil rework solder paste is a solder repair tool suitable for ASIC miner PCB, BGA, SMD, PGA and other electronic devices. It removes oxides, protects the solder metal, and allows liquid solder to flow. Low smoke, low residual surface insulation resistance after curing, therefore, minimal interference to the electrical performance of communication products. The soldering oil is a no-clean flux paste, and the color of the residue is very light. It is easy to use for ball array solder joint repair and ball repair, submerged arc welding, electroslag welding, etc.

Features:

Lead-free and halogen-free, environmentally friendly

Non-resistance flux paste, non-conductive after soldering

Less bright spots, less smoke, no pungent smell, no running ball

Specifications:

Model: AL-UV559

Chemical composition: silica>30%

Melting point: <200℃

Applications:

BGA chip tin planting, SMT repair, sensor, CPU repair and disassembly, precision electronic component welding, north-south bridge, graphics card, mobile phone chip, bump board bridge, lighting, etc.